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POM C 9021 TF XAP 含PTFE润滑剂,耐水解

添加时间:2013-06-14  信息来源:http://www.simibc.com/  作者:苏州希普能塑料
hostaform pom C 9021 TF XAP² ™
 
HOSTAFORM C 9021 TF XAP² ™ | POM | Tribological
 
Description
Chemical abbreviation according to ISO 1043-1: POM
Molding compound ISO 9988- POM-K, M-GNS, 2-2
 
POM copolymer
 
Injection molding type, modified with PTFE;  good chemical resistance to solvents, fuel and strong alkalis as well as good hydrolysis resistance; high resistance to thermal and oxidative degradation; for sliding combinations with very low coefficient of friction.
 
Reduced emission grade. Emissions according to VDA 275 < 5 mg/kg
 
Burning rate ISO 3795 and FMVSS 302 < 100 mm/min for a thickness more than 1 mm.
 
Ranges of applications:  For sliding combinations with very low coefficient of friction.
 
FMVSS = Federal Motor Vehicle Safety Standard (USA)
 
Preliminary data sheet
 
Other Processing
Injection Molding
Standard injection moulding machines with three phase (15 to 25 D) plasticating screws will fit.
 
Melt temperature:190-230℃
Mould temperature:80-120℃
 
ISO Data Mechanical properties Value Unit Test Standard
Phys Density 1510 kg/m³ ISO 1183
Melt volume rate (MVR) 6 cm³/10min ISO 1133
MVR test temperature 190 ISO 1133
MVR test load 2.16 kg ISO 1133
Mold shrinkage - parallel 2 % ISO 294-4
Mold shrinkage - normal 1.7 % ISO 294-4
Water absorption (23℃-sat) 0.65 % ISO 62
Mech Mechanical properties Value Unit Test Standard
Tensile modulus (1mm/min) 2350 MPa ISO 527-2/1A
Tensile stress at yield (50mm/min) 47 MPa ISO 527-2/1A
Tensile strain at yield (50mm/min) 7 % ISO 527-2/1A
Nominal strain at break (50mm/min) 16 % ISO 527-2/1A
Tensile creep modulus (1h) 2000 MPa ISO 899-1
Tensile creep modulus (1000h) 1150 MPa ISO 899-1
Flexural modulus (23℃) 2250 MPa ISO 178
Charpy impact strength @ 23℃ 60 kJ/m² ISO 179/1eU
Charpy impact strength @ -30℃ 60 kJ/m² ISO 179/1eU
Charpy notched impact strength @ 23℃ 4 kJ/m² ISO 179/1eA
Charpy notched impact strength @ -30℃ 4 kJ/m² ISO 179/1eA
Therm Thermal properties Value Unit Test Standard
Melting temperature (10℃/min) 166 ISO 11357-1,-2,-3
DTUL @ 1.8 MPa 98 ISO 75-1/-2
Coeff.of linear therm. expansion (parallel) 1.1 E-4/℃ ISO 11359-2
Elec Electrical properties Value Unit Test Standard
Relative permittivity - 100 Hz 3.7 - IEC 60250
Relative permittivity - 1 MHz 3.7 - IEC 60250
Dissipation factor - 100 Hz 20 E-4 IEC 60250
Dissipation factor - 1 MHz 80 E-4 IEC 60250
Volume resistivity 1E12 Ohm*m IEC 60093
Surface resistivity 1E14 Ohm IEC 60093
Electric strength 33 kV/mm IEC 60243-1
Comparative tracking index CTI 600 - IEC 60112
SpecProd Test specimen production Value Unit Test Standard
Processing conditions acc. ISO 9988 - Internal
 
Processing
Pre Drying
Necessary low maximum residual moisture content: 0.15%
 
It is normally not necessary to dry HOSTAFORM. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A circulating air drying cabinet can be used for this purpose.
 
The product can then be stored in standard conditions until processed.
 
Drying time (h):3 - 4
Drying temperature (℃):100 - 120
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